Lecturer: Prof. Klaus Dilger, Prof. Sven Hartwig
Start: see StudIP
Closure: Bachelor
Credit points: 5
Module number: MB-IFS-14
Rotation: winter semester
The dates for the Exercise will be announced in the lecture.
After completion of this module, students will have the basic knowledge to name and describe joints in packaging and interconnection technology, especially for electronics production. The acquired knowledge about the design, layout and manufacture of such joints enables the students to compare and evaluate existing systems and to theoretically design basic workflows for their manufacture. On the basis of a multitude of applications, the students gain in-depth knowledge in order to assess and select joining techniques of the assembly and joining technology under consideration of practical problems.
Mediation of the basics and consolidation using the example of applications for the following topics of packaging and interconnection technology (AVT):