The following page gives an overview of the equipment of the research group
iAF (TU BS)
- Interrogator SPK155 for Fiber Bragg Grating Sensors (MIOPAS)
- Autoklav (diameter 1.5m, depth 2m; 10bar), 400°C upgradeable
- Laser-Scanning Vibrometer PSV 400 (Polytec)
IMSAS (Uni Bremen)
- 900m2 clean room area class 6 operated according to DIN EN ISO 9001:2008 quality management guidelines
- Photolithography
- Thermal processing
- Deposition processes
- Etching
- Electroplating
- Wafer bonding
- Packaging and interconnection technology
- Coating thickness gauges
- Scanning electron microscope
- impedance spectroscopy
- Network Analyser
IWT (Bremen)
- Xray-Microscope ZEISS Xradia 520 Versa
IMT (TU BS)
- 300 m² clean room: Spray processor, two spin coaters, wet banches, mask-aligner (EVG 620), Masking pattern generator (Heidelberg Instruments DWL 66), four level furnace, sputtering system, PECVD system, ICP dry etching system, Micro spark erosion system (Sarix), barrel etcher (STS 308), ultrasonic hot stamping system, Electroplating plant, ink jet printer (for microfabrication), stylus profiling system (Dektak 8)
- Laser laboratory: Femtosecond laser microstructuring machine, INST 188/391-1, 2-photon-polymerization workstation INST 188/417-1, CO2-laser workstation.
- Stereoscopic Micro-Particle Image Velocimetry INST 188/427-1
- Two confocal laser scanning microscopes (Keyence), one with fluorescence (Zeiss)
- Scanning electron microscope (SEM) with EDX (DSM 960)
- Table top SEM (Phenom)
- Atomic Force Microscope
- Wafer dicing saw (DAD 320)
