This week our colleagues Eike Trumann, Gia Bao Thieu and Prof. Guillermo Payá Vayá are taking part in the ARC 2023 Conference in Cottbus, Germany. Eike presented our paper on "Radiation Tolerant Reconfigurable Hardware Architecture Design Methodology".

Eike's research aims to develop a new methodology to design and evaluate cost-effective radiation hardening architectures. The research first investigates the radiation hardness of an existing FPGA device under different radiation sources. Then, a new simulation fault injection environment is developed for modelling the fault probability of each FPGA memory component for a given radiation environment. Finally, new cost-effective radiation hardening mechanisms will be proposed and evaluated using the previously proposed environment.

At ARC 2023, the results of our collaboration with the research group of Prof. Marc Reichenbach,  University Rostock, was presented in form of the paper "TAPRE-HBM: Trace-Based Processor Rapid Emulation Using HBM on FPGAs". The aim of the collaboration was to develop an emulation framework to evaluate the behavior of application traces on FPGA devices with HBM memory in real time. Future work will optimize the memory accesses of our V2PRO system for HBM memory controllers.