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The design of elastic bonds is currently mainly based on the so-called nominal stress concept. This type of design is relatively simple in terms of the computational effort involved. However, it cannot be transferred to different geometries because stress or strain states cannot be detected with a high local resolution.
The aim of the project is to develop a method for the local deformation analysis of elastic bonded joints. The principle is based on the particle tracking of marker particles introduced into the adhesive by means of in-situ computed tomography measurements. The adhesive matrix is imaged almost artifact-free, as well as the marker particles embedded in the adhesive and cavities that are also contained. Thus, among other things, the particle behavior under load can be analyzed and delamination effects between marker particles and adhesive matrix can be identified. Exact particle tracking can be realized.
In the project, a method for direct high-resolution strain measurement in adhesive layers is being researched that opens up new possibilities for the design of bondings. The experimental effort for the determination of characteristic values is thereby considerably reduced. The improved understanding of materials resulting from the results creates new and better modeling and simulation possibilities.
The long-term goal is to develop a design tool from these results that is directly available to small and medium-sized enterprises (SMEs). The method used is much more accurate and also more transferable than the current nominal voltage concept. The obtained tool saves the SME the computationally and thus time-consuming FE-calculations, which must be connected at present as preliminary investigations to the respective dimensioning processes.
